SMT

Void-free soldering is a basic requirement in the high-performance electronics, SMT offers an unique solution on the market.

The vacuum process starts after the melting process in the peak area through an in-line transports system in the vacuum chamber.

By using vacuum the voids of the solder joint are drawn and the assembly is subsequently moved to the cooling zone.

Datasheet Vaccum

Product range High Temperature systems: the extensive range of SMT products offers exactly the right solution for your specific requirements.

All HTT systems guarantee perfect heat transfer, outstanding energy efficiency and optimum process reliability.

A unique condensation trap system helps to have fast and easy maintenance.

Datasheet Reflow