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Vacuum : four de refusion sous vide

Void-free soldering is a basic requirement in the high-performance electronics, SMT offers an unique solution on the market.

The vacuum process starts after the melting process in the peak area through an in-line transports system in the vacuum chamber.

By using vacuum the voids of the solder joint are drawn and the assembly is subsequently moved to the cooling zone.

Refusion, polymérisation & tropicalisation

Product range High Temperature systems: the extensive range of SMT products offers exactly the right solution for your specific requirements.

All HTT systems guarantee perfect heat transfer, outstanding energy efficiency and optimum process reliability.

A unique condensation trap system helps to have fast and easy maintenance.   

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